High bonding strength metal film on ceramic fabricated by the catalysis of exsolved nanoparticles combining DLP-based ceramic 3D printing

Here, we report that metal films with high bonding strength are deposited on alumina ceramic substrates by virtue of alumina light curing technology, the interface of which can withstand repeated thermal shocks from 1073 K to 77 K. Unlike conventional nickel particles deposited on alumina, exsolved Ni particles are epitaxially bonded to the substrate and catalyze the formation of metal films via chemical deposition, generating the "nanopinning effect". Furthermore, we reveal the exsolution mechanism of particle and weakened Ostwald ripening effect critical for future design of exsolution-based reducible ceramic materials for chemical catalysis and other functionalities. In addition, the metallized ceramic heater and circuit board are fabricated, which show excellent thermal resistance and conductivity respectively. The proposed technique free from traditional sensitization and activation processes opens up a promising strategy of implementing complicated three-dimension constructions with high bonding strength metal films.