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Jing XL, Liao QM, Liang MS et al. Three-dimensional measurement enabled by single-layer all-in-one transmitting-receipting optical metasystem. Opto-Electron Adv 8, 240299 (2025). doi: 10.29026/oea.2025.240299
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Article Open Access
Three-dimensional measurement enabled by single-layer all-in-one transmitting-receipting optical metasystem
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Abstract
Optical three-dimensional (3D) measurement is a critical tool in micro-nano manufacturing, the automotive industry, and medical technology due to its nondestructive nature, high precision, and sensitivity. However, passive light field system still requires a refractive primary lens to collect light of the scene, and structured light can not work well with the highly refractive object. Meta-optics, known for being lightweight, compact, and easily integrable, has enabled advancements in passive metalens-array light fields and active structured light techniques. Here, we propose and experimentally validate a novel 3D measurement metasystem. It features a transmitting metasurface generating chromatic line focuses as depth markers and a symmetrically arranged receiving metasurface collecting depth-dependent spectral responses. A lightweight, physically interpretable algorithm processes these data to yield high-precision depth information efficiently. Experiments on metallic and wafer materials demonstrate a depth accuracy of ±20 µm and lateral accuracy of ±10 µm. This single-layer optical metasystem, characterized by simplicity, micro-level accuracy, easy installation and scalability, shows potential for diverse applications, including process control, surface morphology analysis, and production measurement.-
Keywords:
- metasystem /
- 3D reconstruction /
- dispersion engineering
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References
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Supplementary information for Three-dimensional measurement enabled bysingle-layer all-in-one transmitting-receiptingoptical metasystem 
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Jing XL, Liao QM, Liang MS et al. Three-dimensional measurement enabled by single-layer all-in-one transmitting-receipting optical metasystem. Opto-Electron Adv 8, 240299 (2025). doi: 10.29026/oea.2025.240299
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Figure 1.
Schematic diagram of the three-dimensional measurement metasystem. The integrated transceiver design enables detection of processed structures on the wafer surface, facilitating a compact, miniaturized, non-contact inspection system.
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Figure 2.
(a) Schematic diagram of the metasurface unit structure. (b) Polarization conversion efficiency (range 0-1) of the selected unit structure at the starting wavelength, middle wavelength, and cutoff wavelength. (c) SEM image of the fabricated metasurface sample. (d) Focusing behavior along the Z direction at a distance of 3.5 mm from the optical axis for different wavelengths. (e) Comparison of experimental results and simulation results for focusing effects at different wavelengths.
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Figure 3.
(a) Schematic diagram of data calibration. (b) Schematic diagram of data acquisition for the object under test. (c) 3D reconstruction result.
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Figure 4.
(a) Diagram of the wafer under test, with the red frame indicating the patterns to be measured. (b) Reconstruction results of circular holes at different depths. (c) Reconstruction results of gratings with different widths. (d) Reconstruction results of cross-shaped markers. (e) Restoration results of circular holes along the y direction at different depths. (f) Restoration results of gratings along the y direction with different widths. (g) Restoration results of cross-shaped markers along the y direction.
